1/7 STPS16H100CT/cg/cfp/cr ? april 2002 - ed: 1a high voltage power schottky rectifier i f(av) 2x8a v rrm 100 v tj (max) 175 c v f (max) 0.64 v main product characteristics n negligible switching losses n high junction temperature capability n low leakage current n good trade off between leakage current and for- ward voltage drop features and benefits dual center tap schottky rectifier designed for high frequency miniature switch mode power supplies such as adaptators and on board dc/dc converters. description to-220ab STPS16H100CT a1 a2 k symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) rms forward current 30 a i f(av) average forward current d = 0.5 to-220ab d 2 pak/i 2 pak tc = 165c per diode 8 a to-220fpab tc = 150c per device 16 i fsm surge non repetitive forward current tp = 10 ms sinusoidal 200 a i rrm repetitive peak reverse current tp = 2 m s squar e f = 1khz 1 a i rsm non repetitive peak reverse current tp = 100 m s square 2 a t stg storage temperature range - 65 to + 175 c tj maximum operating junction temperature * 175 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values, per diode) * : dptot dtj rth j a < - 1 () thermal runaway condition for a diode on its own heatsink a1 a2 k d 2 pak stps16h100cg a1 a2 k to-220fpab stps16h100cfp a1 k a2 i 2 pak stps16h100cr a1 a2 k
STPS16H100CT/cg/cfp/cr 2/7 symbol parameter value unit r th (j-c) junction to ambient to-220ab / d 2 pak/i 2 pak per diode 1.6 c/w to-220fpab 4 to-220ab / d 2 pak/i 2 pak total 1.1 c/w to-220fpab 3.5 r th (c) to-220ab / d 2 pak/i 2 pak coupling 0.6 c/w to-220fpab 3 thermal resistances symbol parameter tests conditions min. typ. max. unit i r * reverse leakage current tj = 25c v r =v rrm 3.6 m a tj = 125c 1.6 5 ma v f ** forward voltage drop tj = 25c i f = 8 a 0.77 v tj = 125 ci f = 8 a 0.59 0.64 tj = 25c i f = 16 a 0.88 tj = 125c i f = 16 a 0.67 0.73 static electrical characteristics (per diode) pulse test : * t p=5ms, d <2% ** tp = 380 m s, d <2% to evaluate the conduction losses use the following equation : p=0.55xi f(av) + 0.011 x i f 2 (rms) 0 1 2 3 4 5 6 7 012345678910 i (a) f(av) d = 0.05 d = 0.1 d = 0.2 d = 0.5 d = 1 p (w) f(av) t d =tp/t tp fig. 1: conduction losses versus average current. 0 1 2 3 4 5 6 7 8 9 0 25 50 75 100 125 150 175 t (c) amb rth (j-a) =rth (j-c) rth (j-a) =50c/w to-220ab/d2pak/i2pak i (a) f(av) t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d =0.5). when the diodes 1 and 2 are used simultaneously : d tj(diode 1) = p(diode1) x r th(j-c) (per diode) + p(diode 2) x r th(c)
STPS16H100CT/cg/cfp/cr 3/7 0 20 40 60 80 100 120 140 160 180 200 1.e-03 1.e-02 1.e-01 1.e+00 t(s) t c =25c t c =75c t c =125c i (a) m i m t d =0.5 fig. 3-1: non repetitive surge peak forward current versus overload duration (maximum values) (to-220ab, d2pak, i2pak). 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 0 102030405060708090100 v (v) r t j =150c t j =125c t j =25c t j =100c t j =75c t j =50c i (ma) r fig. 5: reverse leakage current versus reverse voltage applied (typical values). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 t (s) p zth(j-c) / rth(j-c) t d =tp/t tp d = 0.5 d = 0.2 d = 0.1 single pulse fig. 4-1: relative variation of thermal impedance junction to case versus pulse duration (to-220ab, d2pak & i2pak). 0 10 20 30 40 50 60 70 80 90 100 110 120 1.e-03 1.e-02 1.e-01 1.e+00 t(s) t c =25c t c =75c t c =125c i m t d =0.5 i (a) m fig. 3-2: non repetitive surge peak forward current versus overload duration (maximum values) (to-220fpab). 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 t (s) p zth(j-c) / rth(j-c) d = 0.5 d = 0.2 d = 0.1 single pulse t d =tp/t tp fig. 4-2: relative variation of thermal impedance junction to case versus pulse duration (to-220fpab). 0.01 0.10 1.00 1 10 100 v (v) r f=1mhz v osc =30mv t j =25c c(nf) fig. 6: junction capacitance versus reverse volt- age applied (typical values).
STPS16H100CT/cg/cfp/cr 4/7 1 10 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 v (v) fm t j =25c (maximum values) t j =125c (maximum values) t j =125c (maximum values) t j =125c (typical values) t j =125c (typical values) i (a) fm fig. 7: forward voltage drop versus forward cur- rent. 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 s(cm2) d2pak rth(j-a)(c/w) fig. 8: thermal resistance junction to ambient versus copper surface under tab (epoxy printed board fr4, cu = 35m). package mechanical data to-220ab a c d l7 dia l5 l6 l9 l4 f h2 g g1 l2 f2 f1 e m ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 typ. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151
STPS16H100CT/cg/cfp/cr 5/7 package mechanical data to-220fpab h l3 l2 l4 l6 g g1 f f1 l5 d e l7 a b dia f2 ref. dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 f2 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 1.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126
STPS16H100CT/cg/cfp/cr 6/7 package mechanical data d 2 pak 8.90 3.70 1.30 5.08 16.90 10.30 footprint a c2 d r a2 m v2 c a1 g l l3 l2 b b2 e * * flat zone no less than 2mm ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8
STPS16H100CT/cg/cfp/cr 7/7 information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 2002 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - finland - france - germany hong kong - india - israel - italy - japan - malaysia - malta - morocco - singapore spain - sweden - switzerland - united kingdom - united states. http://www.st.com package mechanical data i 2 pak e d l l1 l2 b1 b b2 e a c2 a1 c ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e 10.0 10.4 0.394 0.409 l 13.1 13.6 0.516 0.535 l1 3.48 3.78 0.137 0.149 l2 1.27 1.40 0.050 0.055 ordering type marking package weight base qty delivery mode STPS16H100CT STPS16H100CT to-220ab 2.20 g 50 tube stps16h100cfp stps16h100cfp to-220fpab 2.0 g 50 tube stps16h100cg stps16h100cg d 2 pak 1.48 g 50 tube stps16h100cg-tr stps16h100cg d 2 pak 1.48 g 1000 tape & reel stps16h100cr stps16h100cr i 2 pak 1.9 g 50 tube n epoxy meets ul94,v0
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